Design: minimalist
Location: South Korea
Project Type: Produced
Client: Samsung Electronics
Product Launch Location: Global
Packaging Contents: Smartphone
Packaging Substrate / Materials: Plastic
Printing Process: Coloured Flim
Due to the high demand for Samsung Exynos, Samsung Electronics have decided to expend Exynos from a processor chip into a reference platform. “The Samsung Reference Platform is the official reference platform powered by Exynos solutions and provides an easy development environment with the essential functionalities and the latest technologies. Developers are able to modify their devices or software by referring to the Samsung Reference Platform.”
The package concists of a smartphone built with the Exynos technologies, a sliver display case and a carriable rigid box.